ITC Institutes Investigation (337-TA-851) Regarding Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths
Friday, July 6th, 2012On June 29, 2012, the U.S. International Trade Commission issued a press release announcing their vote to institute an investigation of Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths and Products Containing Same (Inv. No. 337-TA-851). The investigation is based on a May 31, 2012 complaint filed by Industrial Technology Research Institute of Taiwan [...]
