ITC Institutes Investigation (337-TA-851) Regarding Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths
On June 29, 2012, the U.S. International Trade Commission issued a press release announcing their vote to institute an investigation of Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths and Products Containing Same (Inv. No. 337-TA-851).
The investigation is based on a May 31, 2012 complaint filed by Industrial Technology Research Institute of Taiwan and ITRI International of San Jose, California alleging violation of Section 337 in the importation into the U.S. and sale of certain integrated circuit packages provided with multiple heat-conducting paths and products containing same that infringe one or more claims of U.S. Patent No. 5,710,459. See our June 4, 2012 post for more details.
According to the Notice of Investigation, the ITC has identified LG Electronics, Inc. of South Korea and LG Electronics, U.S.A., Inc. of Englewood Cliffs, New Jersey as the respondents in this investigation.
Lastly, Chief ALJ Charles E. Bullock issued a notice indicating that Thomas B. Pender will be the presiding Administrative Law Judge in this investigation.